Elongated fasteners for securing together electronic components and substrates, semiconductor device assemblies including such fasteners, and accompanying systems

ABSTRACT

Semiconductor device assemblies include elements such as electronic components and substrates secured together by a fastener that includes an elongated portion extending continuously through an aperture in two or more such elements. Computer systems include such semiconductor device assemblies. Fasteners for securing together such elements include an elongated portion, a first end piece, and a second end piece. Methods of securing together a plurality of semiconductor devices include inserting an elongated portion of a fastener through an aperture in a first semiconductor device and an aperture in at least one additional semiconductor device. Circuit boards include a plurality of apertures disposed in an array corresponding to an array of apertures in a semiconductor device assembly. Each aperture is sized and configured to receive a fastener for maintaining an assembled relationship between the semiconductor device assembly and the circuit board.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to elements for securingelectronic components to one another and, more particularly, tofasteners that extend through apertures in two or more electroniccomponents and that are configured to maintain an assembled relationshipbetween the electronic components. The present invention also relates tomethods for attaching semiconductor devices together, methods forattaching semiconductor devices to substrates, and methods forestablishing electrical communication between semiconductor devices andsubstrates using fasteners.

2. Discussion of Related Art

In the field of electronic devices, individual elements or componentsare both structurally and electrically assembled. For example, in acomputer system, a memory module may be electrically and structurallycoupled to a motherboard. The memory module itself may include asemiconductor device package that is both electrically and structurallycoupled to a circuit board. Even the semiconductor device package of thememory module may include two or more semiconductor dice that are bothelectrically and structurally coupled to one another. Such semiconductordevice packages that include two or more semiconductor dice are commonlyreferred to as multi-chip modules (“MCM”).

MCM designs often include two or more semiconductor device packages orsubstantially bare semiconductor dice stacked vertically on top of oneanother, the stack being attached to a circuit board. Electricalcommunication between the integrated circuit contained within eachsemiconductor device package or semiconductor die and the underlyingcircuit board typically is established by way of conductive leads, bondwires, or other conductive structures. The conductive leads, bond wires,conductive traces carried by a flexible dielectric substrate (such asthose used in conventional tape-automated bonding (TAB) processes) orother conductive structures typically are routed in a lateral directionfrom a surface of the semiconductor device package or semiconductor diebeyond a lateral surface thereof and down to a surface of the circuitboard.

The individual packages or dice in the MCM generally are structurallycoupled to one another using an adhesive material such as, for example,epoxy applied therebetween. Alternatively, dual sided adhesive tape maybe used to structurally couple the individual semiconductor devicepackages or semiconductor dice to one another.

Several drawbacks exist with conventional MCM designs. First, themethods in which the individual packages or dice are structurallycoupled together do not facilitate rework procedures. For example, if anindividual package or die in a MCM is found to be defective duringtesting after fabrication thereof, scrapping of the entire MCM may berequired due to permanent adhesive bonds between the defective packageor die and the adjacent components of the module. Second, manyconventional MCM designs require that electrically conductive structuresor materials be provided laterally alongside each individual package ordie in the MCM, which requires that the MCM module occupy a largersurface area on a higher level substrate to which the MCM module isattached, such as a circuit board.

Therefore, it would be advantageous to develop a method for securing twoor more elements or components of an electronic device to one another toform an assembly that facilitates replacement or re-working of theassembly during fabrication thereof, and that allows for increaseddensity.

BRIEF SUMMARY OF THE INVENTION

In one aspect, the present invention includes a semiconductor deviceassembly that includes a first electronic component and at least oneadditional electronic component at least partially secured together byat least one fastener. The at least one fastener includes an elongatedportion that extends continuously through an aperture extending throughthe first electronic component and an aperture extending through thesecond electronic component.

In another aspect, the present invention includes at least oneelectronic component and an assembly substrate that are at leastpartially secured together by at least one fastener. The at least onefastener includes an elongated portion that extends continuously throughan aperture that extends through the electronic component and anaperture that extends through the assembly substrate.

In still another aspect, the present invention includes a computersystem that includes an electronic signal processor in communicationwith at least one input device and at least one output device, and anelectronic device assembly. The electronic device assembly includes atleast one electronic component and an assembly substrate that are atleast partially secured together by at least one fastener. The at leastone fastener includes an elongated portion that extends continuouslythrough an aperture that extends through the electronic component and anaperture that extends through the assembly substrate.

In another aspect, the present invention includes a method of securingtogether a plurality of semiconductor devices. A first semiconductordevice is provided that includes at least one aperture extendingtherethrough. At least one additional semiconductor device is providedthat includes at least one aperture extending therethrough. A fasteneris provided that includes an elongated portion, and the elongatedportion is inserted through the at least one aperture that extendsthrough the first semiconductor device and the at least one aperturethat extends through the additional semiconductor device to at leastpartially secure together the first semiconductor device and theadditional semiconductor device.

In yet another aspect, the present invention includes a fastener forsecuring together a semiconductor device having an aperture extendingtherethrough and at least one of an additional semiconductor device anda substrate. The fastener includes an elongated portion sized andconfigured to pass through an aperture extending through a semiconductordevice, a first end piece, and a second end piece. The first end pieceand the second end piece are sized and configured to prevent passagethereof through the aperture extending through the semiconductor device.

In still another aspect, the present invention includes a circuit boardcomprising a region configured for attachment to a semiconductor deviceassembly. The region includes a plurality of electrically conductivestructures that are configured to make electrical contact withelectrically conductive structures disposed on the semiconductor deviceassembly. The region also includes a plurality of apertures that extendthrough the circuit board. The apertures are disposed in an arraycorresponding to an array of apertures extending through thesemiconductor device assembly. Each aperture is sized and configured toreceive a fastener for maintaining an assembled relationship between thesemiconductor device assembly and the circuit board.

The features, advantages, and alternative aspects of the presentinvention will be apparent to those skilled in the art from aconsideration of the following detailed description taken in combinationwith the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

While the specification concludes with claims particularly pointing outand distinctly claiming that which is regarded as the present invention,the advantages of this invention can be more readily ascertained fromthe following description of the invention when read in conjunction withthe accompanying drawings in which:

FIG. 1A is a perspective view of an illustrative semiconductor deviceassembly that includes a plurality of dielectric fasteners according toteachings of the present invention;

FIG. 1B is a cross-sectional side view of the semiconductor deviceassembly shown in FIG. 1A;

FIG. 2 is a cross-sectional side view of a fastener that may be used inthe semiconductor device assembly shown in FIGS. 1A and 1B;

FIG. 3A is a cross-sectional side view of another fastener that may beused in the semiconductor device assembly shown in FIGS. 1A and 1B;

FIGS. 3B and 3C are enlarged partial views of protrusions extending fromsurfaces of the fastener shown in FIG. 3A;

FIG. 4 is a cross-sectional side view of another fastener that may beused in the semiconductor device assembly shown in FIG S. 1A and 1B;

FIG. 5 is a partial cross-sectional side view of another illustrativesemiconductor device assembly that includes a first plurality ofdielectric fasteners securing together components of a multi-chipmodule, and a second plurality of dielectric fasteners securing themulti-chip module to a higher level substrate according to teachings ofthe present invention;

FIG. 6 is a partial cross-sectional side view of yet anotherillustrative semiconductor device assembly that includes a firstplurality of dielectric fasteners according to teachings of the presentinvention, and a plurality of conductive fasteners according toteachings of the present invention;

FIG. 7 is a partial cross-sectional side view of a portion of anotherillustrative semiconductor device assembly that includes a conductivefastener according to teachings of the present invention;

FIG. 8 is a partial cross-sectional side view of a portion of stillanother illustrative semiconductor device assembly that includes aconductive fastener according to teachings of the present invention;

FIG. 9 is a cross-sectional side view of another illustrativesemiconductor device assembly that includes overlapping semiconductordice secured together and to an underlying substrate using fastenersaccording to teachings of the present invention;

FIG. 10 is a cross-sectional side view of yet another illustrativesemiconductor device assembly that includes semiconductor dice securedtogether and to an underlying substrate using fasteners according toteachings of the present invention;

FIG. 11A is a perspective view of another illustrative semiconductordevice assembly that includes a memory module secured to a higher levelsubstrate using fasteners according to teachings of the presentinvention;

FIG. 11B is a cross-sectional side view of the semiconductor deviceassembly shown in FIG. 11A; and

FIG. 12 is a block diagram of an illustrative computer system thatembodies teachings of the present invention.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the description which follows, like features and elements may beidentified by the same or similar reference numerals for ease ofidentification and enhanced understanding of the disclosure hereof. Suchidentification is by way of convenience for the reader only, however,and is not limiting of the present invention or an implication thatfeatures and elements of various components and embodiments identifiedby like reference numerals are identical or constrained to identicalfunctions.

An illustrative semiconductor device assembly 10 that embodies teachingsof the present invention is shown in FIGS. 1A and 1B. In the embodimentshown therein, the semiconductor device assembly 10 includes amulti-chip module (MCM) having a first electronic component 12A, asecond electronic component 12B, a third electronic component 12C, and afourth electronic component 12D. By way of example and not limitation,each of the electronic components 12A, 12B, 12C, 12D may include asemiconductor device package, a semiconductor die, or any otherelectronic device component.

The electronic components 12A, 12B, 12C, 12D may be stacked on andsecured to an assembly substrate 15. By way of example and notlimitation, the assembly substrate 15 may include a circuit board, aninterposer, a semiconductor die, a semiconductor device package, or anyother substrate.

The semiconductor device assembly 10 may further include a plurality offasteners 16. The fasteners 16 may at least partially structurallycouple and secure together at least some of the electronic components12A-12D and the assembly substrate 15.

In additional embodiments, the semiconductor device assembly 10 mayinclude only one electronic component secured to the assembly substrate15, or the semiconductor device assembly 10 may include two or moreelectronic components secured together without including the assemblysubstrate 15. Furthermore, the semiconductor device assembly 10 mayinclude more than four electronic components secured to the assemblysubstrate 15.

Referring to FIG. 1B, by way of example and not limitation, eachelectronic component 12A-12D may have at least one aperture 18 extendingtherethrough configured to receive at least a portion of a fastener 16.For example, each electronic component 12A-12D may have at least oneaperture 18 extending therethrough for every fastener 16 of thesemiconductor device assembly 10. The assembly substrate 15 may alsohave at least one aperture 20 extending therethrough for every fastener16 of the semiconductor device assembly 10. Each aperture 18 and eachaperture 20 may have a size and shape configured to receive at least aportion of a fastener 16.

By way of example and not limitation, each aperture 18 and each aperture20 may have a cross-sectional shape that is one of circular, triangular,rectangular, pentagonal, hexagonal, etc. In variations of the presentinvention, each fastener 16 may not extend through the entiresemiconductor device assembly 10 including the assembly substrate 15 andeach electronic component 12A-12D. At least some fasteners 16 may extendonly partially through the semiconductor device assembly 10 and, assuch, one or more of the assembly substrate 15 and each of theelectronic components 12A-12D may not have an aperture 20 for everyfastener 16.

Optionally, a dielectric underfill material 30 may be provided betweenadjacent electronic components 12A-12D, and between the first electroniccomponent 12A and the assembly substrate 15. The dielectric underfillmaterial 30 may be used to impart structural rigidity to thesemiconductor device assembly 10, and/or to electrically isolateelectrically conductive structures positioned between the adjacentelectronic components 12A-12D, and between the first electroniccomponent 12A and the assembly substrate 15. The dielectric underfillmaterial 30 may include, for example, a silicone or silicone-basedmaterial, an epoxy or epoxy-based material, a dielectric tape or film, apressure sensitive or reversible adhesive material, or any otherelectrically insulating material. By way of example and not limitation,the dielectric underfill material 30 may include a dielectric tape orfilm, which may be unsecured to the adjacent electronic components12A-12D and/or the assembly substrate 15 to facilitate removal, rework,or repair of the semiconductor device assembly 10 as necessary. Such adielectric tape or film may include apertures extending therethrough asnecessary to accommodate each fastener 16. Furthermore, such dielectrictape or film may conform to and/or seal against surfaces of the adjacentelectronic components 12A-12D and/or the assembly substrate 15.

If each electronic component 12A-12D includes a semiconductor die, eachelectronic component 12A-12D may include an active surface 13 on or inwhich the integrated circuit of the respective semiconductor die isformed. In the embodiment shown in FIG. 1B, the active surface 13 ofeach electronic component 12A-12D faces downward. In additionalembodiments, the active surface 13 of each of the electronic components12A-12D may face upward, or the active surfaces 13 of some electroniccomponents 12A-12D may face upward, while the active surfaces 13 ofother electronic components 12A-12D face downward.

Optionally, electrical contact and communication may be provided betweenat least some of the electronic components 12A-12D and the assemblysubstrate 15. Each electronic component 12A-12D may include electricalcontacts on at least one surface thereof that are arranged in an array.By way of example and not limitation, a plurality of conductivestructures 32 such as, for example, bond pads and/or conductive solderballs, bumps, or posts may be disposed in a selected electricalconnection pattern on or in the active surface 13 of each electroniccomponent 12A-12D.

For example, the conductive structures 32 may be arranged in aball-grid-array (BGA) pattern. A plurality of conductive structures 34such as, for example, conductive lands may be provided on or in the backsurface 14 of each electronic component 12A-12D and on a surface of theassembly substrate 15. Each electronic component 12A-12D and theassembly substrate 15 may further include generally horizontallyextending conductive traces (not shown) and generally verticallyextending conductive vias (not shown) for providing electricalcommunication between the electrical components of the integratedcircuits (not shown) of each electronic component 12A-12D andelectrically conductive structures 36 on or in the assembly substrate15, through the conductive structures 32 and the conductive structures34.

In additional embodiments, an anisotropically conductive film, whichincludes a dielectric film with conductive elements extending through athickness thereof and is typically referred to as a “z-axis conductivefilm,” may be provided between adjacent electronic components 12A-12Dand between the first electronic component 12A and the assemblysubstrate 15 to provide electrical communication between conductivestructures 32 formed on or in the active surface 13 of an electroniccomponent 12B, 12C, 12D and conductive structures 34 formed on or in theback surface 14 of an adjacent electronic component 12A, 12B, 12C, 12D,and between conductive structures 32 formed on or in the active surface13 of the first electronic component 12A and conductive structures 34formed on or in the surface of the assembly substrate 15.

As previously mentioned, generally horizontally extending conductivetraces (not shown) and generally vertically extending conductive vias(not shown) may be provided on or in the assembly substrate 15 forproviding electrical communication between the conductive structures 34,which may be provided on a first surface 37 thereof, and conductivestructures 36, which may be provided on a second, opposite surface 38thereof and configured for electrically coupling the semiconductordevice assembly 10 to a higher level substrate such as, for example, aprinted circuit board (not shown).

An encapsulant material (not shown in FIGS. 1A and 1B) may optionally beprovided over the electronic components 12A-12D of the semiconductordevice assembly 10 to provide structural rigidity and to provideprotection to the electronic components 12A-12D from moisture,contaminants, static electricity, etc.

As best seen in FIG. 2, each fastener 16 may include an elongatedportion 22 that is configured to extend continuously through at least aportion of an aperture 18 extending through one or more of theelectronic components 12A-12D, and through at least a portion of anaperture 20 extending through the assembly substrate 15. The elongatedportion 22 may have a size and shape configured to facilitate insertionof the elongated portion 22 into and through at least two componentsselected from the plurality of electronic components 12A-12D and theassembly substrate 15. The elongated portion 22 may include a unitarybody formed of material without joints or seams. By way of example andnot limitation, the elongated portion 22 of each fastener 16 may beconfigured as a substantially cylindrical rod. In other embodiments, thecross-sectional shape of the elongated portion 22 may be triangular,rectangular, pentagonal, hexagonal, etc. Furthermore, the elongatedportion 22 may have a cross-sectional dimension that is less than about50 microns. The elongated portion 22 of each fastener 16 may beelectrically non-conductive, and may include, for example, a polymermaterial. In other embodiments, the elongated portion 22 of eachfastener 16 may be electrically conductive and may include, for example,a metal or a metal alloy material. Furthermore, the metal material mayinclude a plurality of individual layers or coatings of metal material.

Each fastener 16 may further include an integral end piece 24 integrallyformed with an end of the elongated portion 22 of each fastener 16. Theintegral end piece 24 may be disposed at a first end 23A of theelongated portion 22, and the integral end piece 24 may be sized andconfigured to prevent the integral end piece 24 from passing through theapertures 18 extending through each of the electronic components12A-12D, and through at least a portion of the apertures 20 extendingthrough the assembly substrate 15.

Each fastener 16 may also include a discrete end piece 26, which may beconfigured to be securable to an opposite, second end 23B of theelongated portion 22 of each fastener 16. The discrete end piece 26 mayalso be sized and configured to prevent the discrete end piece 26 frompassing through the apertures 18 extending through each of theelectronic components 12A-12D, and through at least a portion of theapertures 20 extending through the assembly substrate 15. In someembodiments, the discrete end piece 26 may have an aperture 28 extendingtherethrough from a first side 27A thereof to a second side 27B thereof.This aperture 28 extending through the discrete end piece 26 may besized and configured to allow the second end 23B of the elongatedportion 22 to slide at least partially through the discrete end piece26.

In variations that also embody teachings of the present invention, eachfastener 16 may include two discrete end pieces 26, one of which may beconfigured to be securable to the first end 23A of the elongated portion22 and the other may be configured to be securable to the second end 23Bof the elongated portion 22, instead of having an integral end piece 24.

Referring again to FIG. 1B, each aperture 20 extending through theassembly substrate 15 may optionally include an enlarged portion 21 orannular recess configured to receive therein at least a portion of theintegral end piece 24 of a fastener 16. In this configuration, theintegral end piece 24 of each fastener 16 may be recessed within theassembly substrate 15. In other embodiments, the fasteners 16 may beinverted relative to the semiconductor device assembly 10 such that theintegral end piece 24 of each fastener 16 is positioned at the top ofthe semiconductor device assembly 10 adjacent the fourth electroniccomponent 12D and the discrete end piece 26 is positioned at the bottomof the semiconductor device assembly 10 adjacent the assembly substrate15.

The integral end piece 24 and the discrete end piece 26 may be securedto the elongated portion 22 in such a manner as to mechanically hold theindividual electronic components 12A-12D and the assembly substrate 15together. Furthermore, the integral end piece 24 and the discrete endpiece 26 may be configured and secured to the elongated portion 22 insuch a manner as to mechanically hold the individual electroniccomponents 12A-12D and the assembly substrate 15 together in a mannerthat facilitates electrical communication therebetween.

The discrete end piece 26 may be welded or soldered to the second end23B of the elongated portion 22 of each fastener 16. By way of exampleand not limitation, heat may be used to provide a weld between thediscrete end piece 26 and the elongated portion 22. In some embodiments,the discrete end piece 26 may be ultrasonically welded to the second end23B of the elongated portion 22 of each fastener 16, or a laser may beused to weld the discrete end piece 26 to the second end 23B of theelongated portion 22. In other embodiments, an adhesive may be used tosecure the discrete end piece 26 to the second end 23B of the elongatedportion 22 of each fastener 16. Furthermore, the discrete end piece 26may comprise a solder ball, which may be formed on the second end 23B ofthe elongated portion 22. A threaded connection may also be providedbetween the discrete end piece 26 and the second end 23B of theelongated portion 22.

Furthermore, the discrete end piece 26 may be secured to the second end23B of the elongated portion 22 of each fastener 16 by mechanicalinterference. A fastener 44 that includes an elongated portion 46, anintegral end piece 48, and a discrete end piece 50 that is configured tobe securable to an end of the elongated portion 46 by mechanicalinterference is shown in FIG. 3A. By way of example and not limitation,the elongated portion 46 may have at least one protrusion 52 on asurface 47 thereof, and the discrete end piece 50 may have at least onecooperating protrusion 54 on a surface 51 thereof. For example, aplurality of annular protrusions 52 may extend in a radially outwarddirection from a lateral surface 47 of the elongated portion 46, and aplurality of cooperating, interfering annular protrusions 54 may extendin a radially inward direction from an interior surface 51 of thediscrete end piece 50 within an aperture 56 extending therethrough, asshown in FIG. 3A.

Referring to FIG. 3B, each protrusion 52 may include, for example, aretention surface 58 and an insertion surface 60. The insertion surface60 may be configured to facilitate insertion of the elongated portion 46into the aperture 56 extending through the discrete end piece 50, andthe retention surface 58 may be configured to retain the discrete endpiece 50 on the elongated portion 46 of the fastener 44 after an end ofthe elongated portion 46 has been inserted into the aperture 56extending through the discrete end piece 50. The retention surface 58may intersect the insertion surface 60 along an edge 62. By way ofexample and not limitation, the insertion surface 60 may be oriented atan insertion angle 61 relative to an exterior surface 47 of theelongated portion 46 that is greater than ninety degrees (90°), whilethe retention surface 58 may be oriented at a retention angle 59relative to the exterior surface 47 of the elongated portion 46 that isequal to or less than ninety degrees (90°).

Referring to FIG. 3C, each protrusion 54 of the discrete end piece 50may also include, for example, a retention surface 64 and an insertionsurface 66. The retention surface 64 may intersect the insertion surface66 along an edge 68. In a manner similar to that described in relationto the protrusion 52 (FIG. 3B), the insertion surface 66 may be orientedat an insertion angle 67 relative to an interior surface 51 of thediscrete end piece 50 that is greater than ninety degrees (90°), whilethe retention surface 64 may be oriented at a retention angle 65relative to the interior surface 51 of the discrete end piece 50 that isequal to or less than ninety degrees (90°).

Referring again to FIG. 3A, in this configuration, the discrete endpiece 50 may be oriented relative to the elongated portion 46 such thatwhen the elongated portion 46 is inserted into the aperture 56 of thediscrete end piece 50, the insertion surfaces 66 of the protrusions 54on the discrete end piece 50 will abut against the insertion surfaces 60of the protrusions 52 on the elongated portion 46. If sufficientmechanical forces are applied between the discrete end piece 50 and theelongated portion 46, the protrusions 52 and/or the protrusions 54 mayslightly deform, allowing the discrete end piece 50 to slide onto theelongated portion 46 and the protrusions 54 to slide past theprotrusions 52. The geometry of the protrusions 52 and the protrusions54, however, may substantially prevent or hinder removal of the discreteend piece 50 from the elongated portion 46. In particular, once theelongated portion 46 of the fastener 44 has been inserted into theaperture 56 of the discrete end piece 50, the retention surfaces 64 ofthe protrusions 54 may abut against the retention surfaces 58 of theprotrusions 52 to substantially prevent or hinder removal of thediscrete end piece 50 from the elongated portion 46.

The configuration of the fastener 44 shown in FIGS. 3A-3C is only oneexample of the manner in which a discrete end piece 50 may be secured tothe second end of the elongated portion 46 by mechanical interference.It is understood that there are many other embodiments that are intendedto be within the scope of the present invention. By way of example andnot limitation, one of the discrete end piece 50 and the elongatedportion 46 may include one or more protrusions, and the other of thediscrete end piece 50 and the elongated portion 46 may include acooperating recess in which the protrusion rests when the discrete endpiece 50 is provided on the elongated portion 46. Referring to FIG. 4,the elongated portion 46 may include a protrusion 69 and the discreteend piece 50 may include a cooperating recess 70, in which theprotrusion 69 is disposed when the discrete end piece 50 is positionedon the elongated portion 46. In such a configuration, a snap-fit may beprovided between the discrete end piece 50 and the elongated portion 46.

Referring again to FIG. 1B, by at least partially structurally couplingand securing together the assembly substrate 15 and the electroniccomponents 12A-12D with the fasteners 16 (or with fasteners 44 as shownin FIGS. 3A-3C), electrical connections may not be required along thelateral sides of the semiconductor device assembly 10, thereby allowingthe semiconductor device assembly 10 to occupy an area on a higher levelsubstrate (such as, for example, a printed circuit board) that issubstantially equal to, or only slightly larger than, the area of eachelectronic component 12A-12D. While the assembly substrate 15 is shownin FIGS. 1A and 1B to have an area slightly larger than the area of eachelectronic component 12A-12D, the assembly substrate 15 may have an areasubstantially equal to the area of each electronic component 12A-12D.

Moreover, by at least partially structurally coupling and securingtogether the assembly substrate 15 and the electronic components 12A-12Dusing any of the fasteners previously described herein, replacement ofindividual electronic components 12A, 12B, 12C, 12D, replacement of theassembly substrate 15, or other re-working procedures may befacilitated. For example, if one or more electronic components 12A-12Dis found to be defective during testing after manufacturing thesemiconductor device assembly 10, the discrete end piece 26 of eachfastener 16 may be cut off, scraped off, or otherwise removed to allowremoval of the fasteners 16 and disassembly of the semiconductor deviceassembly 10. The defective electronic component 12A, 12B, 12C, 12D thenmay be replaced, and new fasteners 16 may be used to reassemble thecomponents of the semiconductor device assembly 10. Furthermore, thefasteners 16 may serve to align the conductive structures 32 with theconductive structures 34 when the fasteners 16 are inserted through theassembly substrate 15 and the electronic components 12A-12D.

In addition to securing individual electronic components 12A, 12B, 12C,12D (such as individual semiconductor dice and semiconductor devicepackages) and assembly substrates 15 together, fasteners that embodyteachings of the present invention (such as, for example, the fastener16 shown in FIG. 2 and the fastener 44 shown in FIGS. 3A-3C) may also beused to attach semiconductor devices together on a so-called “waferscale.” In other words, the electronic components 12A-12D may includetwo or more substrates with electronic components in or on thesubstrates (e.g., full or partial semiconductor wafers,silicon-on-insulator (SOI) substrates, and sheets or strips of othertypes of substrates), and such substrates may be secured together byforming a plurality of apertures through each substrate, aligning theapertures with one another, inserting a portion of a fastener through ahole in each substrate, and attaching a discrete end piece to theportion to structurally couple and secure the substrates together. Thestack of structurally coupled substrates may then be diced to form aplurality of stacks of structurally coupled electronic components.

Another illustrative semiconductor device assembly 74 that also embodiesteachings of the present invention is shown in FIG. 5. The semiconductordevice assembly 74 includes two structures 76, 78 fastened together witha plurality of fasteners 84 in accordance with teachings of the presentinvention. In particular, the semiconductor device assembly 74 includesa multi-chip module 76 attached to a higher level substrate 78. By wayof example and not limitation, the higher level substrate 78 may includea motherboard or a daughterboard of a computer system. Moreover, themulti-chip module 76 also includes a plurality of individual electroniccomponents 80A, 80B fastened together with a plurality of fasteners 92in accordance with teachings of the present invention. As shown in FIG.5, the multi-chip module 76 may include a first semiconductor die 80Aand a second semiconductor die 80B, which may be structurally andelectrically coupled to one another and to a module substrate 82 (whichmay include, for example, a circuit board). The second semiconductor die80B may be mounted vertically above the first semiconductor die 80A, asshown in FIG. 5.

The semiconductor device assembly 74 may include a plurality of assemblyfasteners 84 used to at least partially structurally couple and securetogether the multi-chip module 76 and the higher level substrate 78.Each assembly fastener 84 may include an elongated portion 86, anintegral end piece 88, and a discrete end piece 90. The assemblyfasteners 84 may be substantially similar to any of the fastenerspreviously described herein.

The semiconductor device assembly 74 may further include a plurality ofmodule fasteners 92 used to at least partially structurally couple andsecure together the module substrate 82 and the semiconductor dice 80A,80B. Each module fastener 92 may also include an elongated portion 94,an integral end piece 96, and a discrete end piece 98. The modulefasteners 92 may also be substantially similar to any of the fastenerspreviously described herein.

Each semiconductor die 80A, 80B may include an active surface 81A on orin which the integrated circuit of the respective semiconductor die 80A,80B is formed. In the embodiment shown in FIG. 5, the active surface 81Aof each semiconductor die 80A, 80B faces downward. The active surface81A of each semiconductor die 80A, 80B may face upward, or the activesurface 81A of one semiconductor die 80A, 80B may face upward while theactive surface 81A of the other semiconductor die 80A, 80B facesdownward.

A plurality of conductive structures 32 such as, for example, bond padsand/or conductive balls, bumps, studs, columns, pillars posts or landsof metal, alloy (including, without limitation, solder) or otherconductive or conductor-filled or coated material may be provided on orin the active surface 81A of each semiconductor die 80A, 80B. Theconductive structures 32 may be disposed in a selected connectionpattern. By way of example and not limitation, the conductive structures32 may be disposed in a so-called “ball-grid-array” (BGA) connectionpattern on or in an active surface 81A of each semiconductor die 80A,80B. A plurality of conductive structures 34 such as, for example,conductive terminals, may be provided on or in the back surface 81B ofthe first semiconductor die 80A and on a first surface 83A of the modulesubstrate 82. Each semiconductor die 80A, 80B and the module substrate82 may further include generally horizontally extending conductivetraces (not shown) and generally vertically extending conductive vias(not shown) for providing electrical communication between theelectrical components of the integrated circuits (not shown) of eachsemiconductor die 80A, 80B and electrically conductive structures 36 onor in a second surface 83B of the module substrate 82, through theelectrically conductive structures 32 and the conductive structures 34.The electrically conductive structures 36 on the second surface 83B ofthe module substrate 82 may be configured for electrically coupling themulti-chip module 76 to the higher level substrate 78.

An encapsulant material 100 may optionally be provided over thesemiconductor dice 80A, 80B of the multi-chip module 76 to providestructural rigidity and to provide protection to the semiconductor dice80A, 80B from moisture or contaminants. The encapsulant material 100also may include apertures 101 configured to receive the assemblyfasteners 84 to facilitate securing the multi-chip module 76 to thehigher level substrate 78.

Optionally, a dielectric underfill material (not shown) that is distinctfrom the encapsulant material 100 may be provided between the firstsemiconductor die 80A and the second semiconductor die 80B, and/orbetween the first semiconductor die 80A and the module substrate 82, aspreviously discussed in relation to the semiconductor device assembly 10shown in FIG. 1.

With continued reference to FIG. 5, the module fasteners 92 may be usedto align the conductive structures 32 with the conductive structures 34during assembly, and the assembly fasteners 84 may be used to align theelectrically conductive structures 36 with conductive structures 90 inor on a surface 79 of the higher level substrate 78. Furthermore, thehigher level substrate 78 may also include generally horizontallyextending conductive traces (not shown) and generally verticallyextending conductive vias (not shown) for providing electricalcommunication between the multi-chip module 76 and other electricalcomponents or devices (not shown), which may be attached to the higherlevel substrate 78.

In this configuration, re-working procedures of both the semiconductordevice assembly 74 and the multi-chip module 76 may be facilitated. Forexample, if it is desired to re-work the semiconductor device assembly74 to, for example, replace or rework the multi-chip module 76, thediscrete end piece 90 of each fastener 84 may be cut off, scraped off,or otherwise removed to allow removal of the fasteners 84 anddisassembly of the semiconductor device assembly 74. The multi-chipmodule 76 may then be replaced, and new fasteners 84 may be used tore-assemble the semiconductor device assembly 74. In addition, if it isdesired to re-work the multi-chip module 76 to, for example, replace oneor both of the semiconductor dice 80A, 80B, the discrete end piece 98 ofeach fastener 92 may be cut off, scraped off, or otherwise removed toallow removal of the fasteners 92 and disassembly of the multi-chipmodule 76. If the semiconductor device assembly 74 includes anencapsulant material 100, a portion of the encapsulant material 100 maybe removed proximate the discrete end piece 98 of each fastener 92 tofacilitate removal thereof. New fasteners 92 then may be used tore-assemble the multi-chip module 76.

Another illustrative semiconductor device assembly 110 that alsoembodies teachings of the present invention is shown in FIG. 6. Thesemiconductor device assembly 110 includes a multi-chip module 112attached to a higher level substrate 114 such as, for example, amotherboard or daughterboard of a computer system. The semiconductordevice assembly 110 also may include conductive fasteners 128, describedin further detail below, which may be configured to provide electricalcommunication between the multi-chip module 112 and the higher levelsubstrate 114, and/or between the individual electronic components 116A,116B of the multi-chip module 112.

As shown in FIG. 6, the multi-chip module 112 may include a firstsemiconductor die 116A structurally and electrically coupled to a modulesubstrate 118 (which may include, for example, a circuit board), and asecond semiconductor die 116B that is mounted vertically above andstructurally and electrically coupled to the first semiconductor die116A.

The semiconductor device assembly 110 may include a plurality ofassembly fasteners 84 (as previously described in relation to FIG. 5)used to at least partially structurally couple and secure together themulti-chip module 112 and the higher level substrate 114. Each assemblyfastener 84 may include an elongated portion 86, an integral end piece88, and a discrete end piece 90. The assembly fasteners 84 may besubstantially similar to any of the fasteners previously describedherein.

The semiconductor device assembly 110 may further include a plurality ofelectrically conductive module fasteners 128 used to at least partiallystructurally couple and secure together the module substrate 114 and thesemiconductor dice 116A, 116B. Each module fastener 128 may also includean elongated portion 130, an integral end piece 132, and a discrete endpiece 134. The module fasteners 128 may have a size and shape configuredto be substantially similar to the fasteners 16 previously described inrelation to FIG. 2, or they may be configured substantially similar tothe fasteners 44 previously described in relation to FIGS. 3A-3C. Thefasteners 16, however, may comprise an electrically conductive materialsuch as, for example, copper, gold, aluminum or alloys thereof.

Each of the first semiconductor die 116A, the second semiconductor die116B, and the module substrate 118 may include a plurality of apertures136 through which the elongated portion 130 of the module fasteners 128extend. At least some of these apertures 136 may be formed through anelectrically conductive via 138, as shown in FIG. 6. The electricallyconductive vias 138 extending through the semiconductor dice 116A, 116Bmay electrically communicate with one or more components (such as atransistor) of the integrated circuits (not shown) contained within thesemiconductor dice 116A, 116B, while the electrically conductive vias138 extending through the module substrate 118 may electricallycommunicate with one or more conductive traces (not shown) to otherelectrically conductive structures in or on the module substrate 118. Inthis configuration, electrical communication may be provided between theelectrically conductive vias 138 and the electrically conductive modulefasteners 128.

The integral end pieces 132 of the electrically conductive modulefasteners 128 may provide electrical contacts or terminals, which may bealigned with and electrically coupled to electrically conductivestructures 140 provided on or in a surface 115 of the higher levelsubstrate 114. In this configuration, electrical communication may beprovided between the components (such as a transistors) of theintegrated circuits (not shown) contained within the semiconductor dice116A, 116B and other electrical components or devices (not shown), whichmay be attached to the higher level substrate 114 through the conductivevias 138, the electrically conductive module fasteners 128, theelectrically conductive structures 140, and other electricallyconductive traces or vias (not shown) on or in the higher levelsubstrate 114.

An encapsulant material 100 may optionally be provided over thesemiconductor dice 116A, 116B of the multi-chip module 112 to providestructural rigidity and to provide protection to the semiconductor dice116A, 116B from moisture, contaminants, static electricity, etc.

The module fasteners 128 may be used to align the semiconductor dice116A, 116B and the module substrate 118 during assembly (in addition tosecuring the semiconductor dice 116A, 116B and the module substrate 118together and providing electrical communication between thesemiconductor dice 116A, 116B and the higher level substrate 114), andthe assembly fasteners 84 may be used to align the integral end pieces132 of the module fasteners 128 with the conductive structures 140 in oron the surface 115 of the higher level substrate 114 during assembly (inaddition to securing together the multi-chip module 112 and the higherlevel substrate 114).

FIGS. 7 and 8 illustrate different configurations of fasteners andmethods of establishing electrical communication between an electricallyconductive fastener and electrically conductive elements or features ofa semiconductor die or other electrical component.

A portion of another illustrative semiconductor device assembly 150 isshown in FIG. 7. The semiconductor device assembly 150 may include afirst semiconductor die 152A, a second semiconductor die 152B, and athird semiconductor die 152C secured together by at least oneelectrically conductive fastener 154. Each of the semiconductor dice152A-152C may include at least one aperture 156 formed through aconductive via 158. By way of example and not limitation, eachconductive via 158 may include a substantially cylindrical region of anelectrically conductive material (such as, for example, gold, copper, oraluminum) before each aperture 156 is formed therethrough. Each aperture156 may also be substantially cylindrical. In other embodiments, eachaperture 156 and each conductive via 158 may have any other shape.

The at least one electrically conductive fastener 154 may include anelongated portion 160, an integral end piece 162, and a discrete endpiece 164. A plurality of radially outwardly extending protrusions,barbs, or spikes 166 may be provided on a lateral surface 161 of theelongated portion 160 of the conductive fastener 154. These spikes 166may be integrally formed with the elongated portion 160 and may also beelectrically conductive. In this configuration, as the elongated portion160 is inserted through the apertures 156 in the conductive vias 158 ofthe semiconductor dice 152A-152C, the electrically conductive spikes 166may abut against and engage the conductive vias 158 of the semiconductordice 152A-152C, thereby establishing electrical communication betweenthe conductive vias 158 and the elongated portion 160 through the spikes166.

In other embodiments, the spikes 166 may be replaced with simpleprotrusions formed by, for example, roughening the outer lateral surface161 of the elongated portion 160 of the fastener 154 using, for example,an etchant. In such a configuration, the outer lateral surface 161 ofthe elongated portion 160 may be characterized by a plurality ofrandomly shaped protrusions and recesses (not shown). The protrusionsmay be configured to abut against and engage the conductive vias 158 ofthe semiconductor dice 152A-152C.

Moreover, the integral end piece 162 and/or the discrete end piece 164of the fastener 154 may be configured and used as a conductive terminalfor establishing electrical communication between integrated circuitscontained within the individual semiconductor dice 152A-152C of thesemiconductor device assembly 150 and a higher level substrate (such asa circuit board). Optionally, solder balls or other conductive orconductor-filled or coated bumps, studs, columns, pillars, posts orlands, or any other electrically conductive structure may be provided onthe exposed surface 163 of the integral end piece 162 and used tofacilitate electrical coupling of the fastener 154 to a higher levelsubstrate (not shown).

A portion of yet another illustrative semiconductor device assembly 170is shown in FIG. 8. The semiconductor device assembly 170 may include afirst semiconductor die 172A, a second semiconductor die 172B, and athird semiconductor die 172C secured together by at least oneelectrically conductive fastener 174. Each of the semiconductor dice172A-172C may include at least one aperture 176 formed therethrough. Byway of example and not limitation, each aperture 176 may besubstantially cylindrical. In other embodiments, each aperture 176 mayhave any other shape. Each of the semiconductor dice 172A-172C mayinclude an active surface 177.

Each of the semiconductor dice 172A-172C may include at least oneconductive terminal or pad 178 formed on or in an active surface 177thereof adjacent the apertures 176 extending through the semiconductordice 172A-172C. In one particular embodiment, each conductive terminalor pad 178 may be substantially circular and each aperture 176 may beformed in and extend through the circular terminals or pads 178. Inother embodiments, the conductive terminals or pads 178 may have asubstantially rectangular shape or any other shape and may be disposedlaterally adjacent each aperture 176.

The at least one electrically conductive fastener 174 may besubstantially identical to the fastener 154 previously described inrelation to FIG. 7, and may include an elongated portion 180, anintegral end piece 182, and a discrete end piece 184. The fastener 174may further include a plurality of radially outwardly extendingprotrusions, barbs, or spikes 186, which may be substantially identicalto the spikes 166 also previously described in relation to FIG. 7. Inthis configuration, as the elongated portion 180 is inserted through theapertures 156 of the semiconductor dice 172A-172C, the electricallyconductive spikes 186 may abut against and engage the conductiveterminals or pads 178 disposed on the active surfaces 177 of thesemiconductor dice 172A-172C, thereby establishing electricalcommunication between the terminals or pads 178 and the elongatedportion 180 through the spikes 186. Furthermore, the discrete end piece184 may abut against and communicate electrically with at least oneterminal or pad 178 disposed on the active surface 177 of the thirdsemiconductor die 172C, as shown in FIG. 8.

In this configuration, the integral end piece 182 and/or the discreteend piece 184 of the fastener 174 may be configured and used as aconductive terminal for establishing electrical communication betweenintegrated circuits contained within the individual semiconductor dice172A-172C of the semiconductor device assembly 170 and a higher levelsubstrate (such as a circuit board).

Semiconductor device assemblies that embody teachings of the presentinvention may also include semiconductor dice stacked in an offsetconfiguration relative to one another and fastened together usingfasteners that embody teachings of the present invention.

Another illustrative semiconductor device assembly 194 that embodiesteachings of the present invention is shown in FIG. 9. The semiconductordevice assembly 194 includes a multi-chip module, which may include apackage or assembly substrate 196, a first semiconductor die 198A, asecond semiconductor die 198B, and a third semiconductor die 198C. Inother embodiments, the semiconductor device assembly 194 may includemore than three or less than three semiconductor dice. The firstsemiconductor die 198A and the second semiconductor die 198B each may bemounted on and structurally and electrically coupled directly to theassembly substrate 196. The third semiconductor die 198C may be mountedover and structurally coupled to both the first semiconductor die 198Aand the second semiconductor die 198B, as shown in FIG. 9. Thesemiconductor device assembly 194 may optionally include a dielectricencapsulant material 218 (such as, for example, an epoxy-based material)substantially encapsulating the semiconductor dice 198A-198C.

A plurality of relatively long fasteners 200 and a plurality ofrelatively short fasteners 202 may be used to at least partiallystructurally couple the semiconductor dice 198A-198C to the assemblysubstrate 196. The long fasteners 200 each may include an elongatedportion 204 that extends through an aperture extending through theassembly substrate 196, an aperture extending through one of the firstsemiconductor die 198A and the second semiconductor die 198B, and anaperture extending through the third semiconductor die 198C. The longfasteners 200 may also include an integral end piece 206 and a discreteend piece 208. The short fasteners 202 each may include an elongatedportion 212 that extends through an aperture extending through theassembly substrate 196, and through an aperture extending through one ofthe first semiconductor die 198A and the second semiconductor die 198B.The short fasteners 202 may also include an integral end piece 214 and adiscrete end piece 216.

The long fasteners 200 and the short fasteners 202 may be electricallynon-conductive and merely used to structurally couple the semiconductordice 198A-198C to the assembly substrate 196, and to align correspondingelectrically conductive structures (not shown) on the semiconductor dice198A-198C and the assembly substrate 196, as previously discussedherein. In other embodiments, at least some of the long fasteners 200and the short fasteners 202 may be electrically conductive and used toprovide electrical communication between components (such astransistors) of the integrated circuits (not shown) contained within thesemiconductor dice 198A-198C and electrically conductive structures 220(such as, for example, solder balls or conductor-filled epoxy bumps)disposed on the assembly substrate and configured to communicateelectrically with conductive structures on a higher level substrate(such as, for example, a motherboard of a computer system) (not shown).

Each of the multi-chip modules previously described herein includeelectrical contacts arranged in a selected electrical connection patternsuch as, for example, a ball-grid-array (BGA) pattern. Multi-chipmodules that include other types or configurations of semiconductor diceare also encompassed by the present invention.

Another illustrative semiconductor device assembly 224 that embodiesteachings of the present invention is shown in FIG. 10. Thesemiconductor device assembly 224 includes a multi-chip module, whichmay include a package or assembly substrate 226, a first semiconductordie 228A, and a second semiconductor die 228B. The first semiconductordie 228A and the second semiconductor die 228B may be stacked in aback-to-back configuration in which an active surface 229A of the firstsemiconductor die 228A faces downward and an active surface 229B of thesecond semiconductor die 228B faces upward.

The first semiconductor die 228A may include a plurality of bond pads230 disposed on the active surface 229A thereof, the active surface 229Abeing disposed adjacent an upper surface 227A of the assembly substrate226. The bond pads 230 may be positioned substantially along acenterline (not shown) of the first semiconductor die 228A and alignedwith an aperture 227 extending through the assembly substrate 226. Wirebonds 232 may extend through the aperture 227 in the assembly substrate226 between the bond pads 230 and conductive structures (not shown)disposed on a lower surface 227B of the assembly substrate 226 oppositethe first semiconductor die 228A, thereby providing electricalcommunication between the first semiconductor die 228A and the assemblysubstrate 226.

The second semiconductor die 228B may include a plurality of bond pads230 disposed on the active surface 229B thereof. The bond pads 230 maybe positioned substantially along at least two lateral edges 233 of thesecond semiconductor die 228B. The bond pads 230 of the secondsemiconductor die 228B may be electrically coupled to conductivestructures (not shown) disposed on the upper surface 227A of theassembly substrate 226 using tape-automated bonding (TAB) techniques, inwhich patterned conductive traces and terminals (not shown) are carriedon a tape material 234. The tape material 234, together with theconductive traces and terminals, is aligned with and applied to thesemiconductor device assembly 224 such that electrical communication isestablished between the bond pads 230 of the second semiconductor die228B and the conductive structures of the assembly substrate 226 throughthe conductive traces and terminals carried by the tape material 234.

A plurality of fasteners 236, which may be substantially identical toany of those previously described herein, may be used to at leastpartially structurally couple and secure together the firstsemiconductor die 228A, the second semiconductor die 228B, and theassembly substrate 226. The fasteners 236 may each include an elongatedportion 238 that extends through an aperture extending through theassembly substrate 226, an aperture extending through the firstsemiconductor die 228A, and an aperture extending through the secondsemiconductor die 228B. The fasteners 236 may also include an integralend piece 240 and a discrete end piece 242.

The semiconductor device assembly 224 may optionally include adielectric encapsulant material 218 substantially encapsulating thesemiconductor dice 228A and 228B and the wire bonds 232.

Another illustrative semiconductor device assembly 250 that embodiesteachings of the present invention is shown in FIGS. 11A and 11B. Thesemiconductor device assembly 250 may include a semiconductor devicemodule 252 that is structurally coupled and secured to a higher levelsubstrate 254 using a plurality of fasteners 256 that embody teachingsof the present invention. The semiconductor device module 252 mayinclude at least one semiconductor die 258 structurally and electricallycoupled to a module substrate 260. As shown in FIG. 11A, thesemiconductor device module 252 may include a plurality of semiconductordice 258. By way of example and not limitation, the semiconductor devicemodule 252 may comprise a volatile-type memory module such as, forexample, a dynamic random access memory (DRAM) module or a static randomaccess memory (SRAM) module, or the semiconductor device module 252 maycomprise a nonvolatile-type memory module such as, for example, a flashmemory module. In other embodiments, the semiconductor device module 252may comprise a microprocessor device module including a processor die,one or more logic dice and one or more memory dice. In addition, thesemiconductor device module 252 may include other combinations ofmutually differing semiconductor dice 258, such as a CMOS imager diestacked on top of one or more memory dice. Furthermore, the higher levelsubstrate 254 may include, for example, a circuit board such as amotherboard for a computer system.

FIG. 11B is a cross-sectional view of the semiconductor device assembly250 shown in FIG. 11A. As seen therein, each fastener 256 may include anelongated portion 264 that extends continuously through an aperture 274formed in the higher level substrate 254 and through an aperture 276formed in the module substrate 260. Each fastener 256 may furtherinclude an integral end piece 268 and a discrete end piece 270, both ofwhich may be sized and configured to prevent passage thereof through theapertures 274 and the apertures 276. The fasteners 256 may be used toalign conductive structures 280 provided on or in a lower surface of themodule substrate 260 with conductive structures 282 provided on or in asurface of the higher level substrate 254. In this configuration, whenthe semiconductor device module 252 is oriented relative to the higherlevel substrate 254 such that the apertures 276 are aligned with theapertures 274, and the semiconductor device module 252 is structurallycoupled and secured to the higher level substrate 254 using thefasteners 256, electrical communication is established between theconductive structures 280 and the conductive structures 282. The modulesubstrate 260 and the higher level substrate 254 each may furtherinclude generally horizontally extending conductive traces (not shown)and generally vertically extending conductive vias (not shown), whichmay be used to provide electrical communication between the conductivestructures 280 and the semiconductor dice 258 and between the conductivestructures 282 and other electrical components or devices (not shown)that may also be attached to the higher level substrate 254.

The fasteners 256 used to secure the semiconductor device module 252 tothe higher level substrate 254 may be substantially identical to any ofthe fasteners previously described herein. Furthermore, while not shown,each of the semiconductor dice 258 may be structurally and electricallycoupled to the module substrate 260 using fasteners as previouslydescribed herein that embody teachings of the present invention.

By providing semiconductor device modules (such as memory modules andmicroprocessor modules) and higher level substrates (such as circuitboards) that embody teachings of the present invention and includecorresponding arrays of apertures configured to receive fasteners asdescribed herein, semiconductor device modules may be easily andremovably secured and coupled to higher level substrates, which mayeliminate the need for industry standard sockets such as, for example,single inline memory module (SIMM) sockets and dual inline memory module(DIMM) sockets.

An illustrative computer system 286 that embodies teachings of thepresent invention is shown in FIG. 12. The computer system 286 mayinclude a central processing unit 288 including at least one processordevice and at least one memory device. The central processing unit 288includes a semiconductor device assembly as previously described herein,which may comprise at least one of the processor device and the memorydevice.

By way of example and not limitation, the semiconductor device assemblymay include one or more of the semiconductor device assembly 10previously described in relation to FIGS. 1A and 1B, the semiconductordevice assembly 74 previously described in relation to FIG. 5, thesemiconductor device assembly 110 previously described in relation toFIG. 6, the semiconductor device assembly 150 previously described inrelation to FIG. 7, the semiconductor device assembly 170 previouslydescribed in relation to FIG. 8, the semiconductor device assembly 194previously described in relation to FIG. 9, the semiconductor deviceassembly 224 previously described in relation to FIG. 10, or thesemiconductor device assembly 250 previously described in relation toFIGS. 11A and 11B, or another semiconductor device assembly thatembodies teachings of the present invention.

The computer system 286 may further include at least one input device300 (such as, for example, a keyboard, a mouse or other pointer device,or a control panel) and at least one output device 302 (such as, forexample, a monitor or a printer). Furthermore, two or more of thecentral processing unit 288, the input device 300, and the output device302 may be incorporated into a single structural unit, or they may beformed as separate structural units and coupled together usingelectrical wires or wireless technology.

While the present invention has been described in terms of certainillustrated embodiments and variations thereof, it will be understoodand appreciated by those of ordinary skill in the art that the inventionis not so limited. Rather, additions, deletions and modifications to theillustrated embodiments may be effected without departing from thespirit and scope of the invention as defined by the claims which follow.

1. An electronic device assembly comprising: an assembly substratecomprising a plurality of electrically conductive structures disposed ona surface thereof, the assembly substrate having at least one apertureextending therethrough; at least one electronic component comprising aplurality of electrically conductive structures disposed on a surfacethereof, the at least one electronic component having at least oneaperture extending therethrough; and at least one fastener comprising:an elongated portion extending continuously through the at least oneaperture extending through the at least one electronic component and theat least one aperture extending through the assembly substrate, the atleast one fastener at least partially securing together the at least oneelectronic component and the assembly substrate; and at least onediscrete end piece secured to an end of the elongated portion by atleast one of a weld and a press fit, the at least one discrete end piecesized and configured to prevent the at least one discrete end piece frompassing through the at least one aperture extending through the at leastone electronic component and the at least one aperture extending throughthe assembly substrate.
 2. The electronic device assembly of claim 1,wherein the at least one electronic component comprises a semiconductordie or a semiconductor device package.
 3. The electronic device assemblyof claim 2, wherein the at least one electronic component comprises amemory module, the memory module comprising a module substrate and aplurality of semiconductor dice electrically and structurally coupled tothe module substrate.
 4. The electronic device assembly of claim 1,wherein the at least one fastener is configured to align the at leastone electronic component with the assembly substrate to establishelectrical communication between the conductive structures of theassembly substrate and the conductive structures of the at least oneelectronic component.
 5. The electronic device assembly of claim 1,wherein the assembly substrate comprises a printed circuit board.
 6. Theelectronic device assembly of claim 5, wherein the printed circuit boardcomprises a motherboard of a computer system.
 7. The electronic deviceassembly of claim 1, wherein the at least one aperture extending throughthe at least one electronic component and the at least one apertureextending through the assembly substrate each have a cross-sectionalshape that is selected from the group consisting of circular,triangular, rectangular, pentagonal, and hexagonal, the at least oneaperture extending through the assembly substrate being aligned with theat least one aperture extending through the at least one electroniccomponent.
 8. The electronic device assembly of claim 1, wherein theelongated portion of the at least one fastener is substantiallycylindrical.
 9. The electronic device assembly of claim 1, wherein atleast the elongated portion of the at least one fastener is electricallyconductive.
 10. The electronic device assembly of claim 9, wherein theat least one electronic component comprises at least one semiconductordie including an integrated circuit, the elongated portion of the atleast one fastener being configured to electrically communicate with theintegrated circuit of the at least one semiconductor die.
 11. Theelectronic device assembly of claim 9, wherein the elongated portion ofthe at least one fastener comprises at least one conductive protrusionextending from a lateral surface of the at least one fastener, the atleast one conductive protrusion configured to communicate electricallywith at least one of the plurality of conductive structures disposed onthe surface of the at least one electronic component.
 12. The electronicdevice assembly of claim 11, wherein the at least one aperture extendingthrough the at least one electronic component extends through one of aconductive terminal on a surface of the at least one electroniccomponent and a conductive via extending through the at least oneelectronic component.
 13. The electronic device assembly of claim 1,wherein at least the elongated portion of the at least one fastener iselectrically non-conductive.
 14. The electronic device assembly of claim1, wherein the at least one fastener further comprises an integral endpiece integrally formed with the elongated portion, the integral endpiece being disposed at an end of the elongated portion and sized andconfigured to prevent the integral end piece from passing through the atleast one aperture extending through the at least one electroniccomponent and the at least one aperture extending through the assemblysubstrate.
 15. The electronic device of claim 1, wherein the at leastone discrete end piece has an aperture extending therethrough from afirst end thereof to a second end thereof, the aperture extendingthrough the at least one discrete end piece being sized and configuredto allow the end of the elongated portion to slide at least partiallytherethrough.
 16. The electronic device assembly of claim 1, wherein theelongated portion of the at least one fastener comprises at least oneannular feature on a lateral surface thereof, and wherein the at leastone discrete end piece comprises at least one annular feature on asurface thereof within the at least one aperture extending therethrough,mechanical interference between the at least one annular feature on theat least one fastener and the at least one annular feature on the atleast one discrete end piece at least partially securing the discreteend piece to the end of the elongated portion.
 17. The electronic deviceassembly of claim 16, wherein the at least one annular feature on alateral surface of the elongated portion of the at least one fastenercomprises a protrusion, and wherein the at least one annular feature ona surface of the at least one discrete end piece is selected from thegroup consisting of a protrusion and an indentation.
 18. A computersystem comprising: an electronic signal processor in communication withat least one input device and at least one output device; and anelectronic device assembly comprising: an assembly substrate comprisinga plurality of electrically conductive structures disposed on a surfacethereof, the assembly substrate having at least one aperture extendingtherethrough; at least one electronic component comprising a pluralityof electrically conductive structures disposed on a surface thereof, theat least one electronic component having at least one aperture extendingtherethrough; and at least one fastener comprising: an elongated portionextending continuously through the at least one aperture extendingthrough the at least one electronic component and the at least oneaperture extending through the assembly substrate, the at least onefastener at least partially securing together the at least oneelectronic component and the assembly substrate; and at least onediscrete end piece secured to an end of the elongated portion by atleast one of a weld and a press fit, the at least one discrete end piecesized and configured to prevent the at least one discrete end piece frompassing through the at least one aperture extending through the at leastone electronic component and the at least on aperture extending throughthe assembly substrate.
 19. The computer system of claim 18, wherein theat least one electronic component comprises a semiconductor die or asemiconductor device package.
 20. The computer system of claim 19,wherein the at least one electronic component comprises a memory module,the memory module comprising a module substrate and a plurality ofsemiconductor dice electrically and structurally bonded to the modulesubstrate.
 21. The computer system of claim 19, wherein the assemblysubstrate comprises a printed circuit board.
 22. The computer system ofclaim 21, wherein the printed circuit board comprises a motherboard. 23.The computer system of claim 18, wherein the at least one fastener isconfigured to align the at least one electronic component with theassembly substrate to establish electrical communication between theplurality of electrically conductive structures of the assemblysubstrate and the plurality of electrically conductive structures of theat least one electronic component.
 24. The computer system of claim 18,wherein the at least one aperture extending through the at least oneelectronic component and the at least one aperture extending through theassembly substrate each have a cross-sectional shape that is selectedfrom the group consisting of circular, triangular, rectangular,pentagonal, and hexagonal, the at least one aperture extending throughthe assembly substrate being aligned with the at least one apertureextending through the at least one electronic component.
 25. Thecomputer system of claim 18, wherein the elongated portion of the atleast one fastener comprises a substantially cylindrical rod.
 26. Thecomputer system of claim 18, wherein at least the elongated portion ofthe at least one fastener is electrically conductive.
 27. The computersystem of claim 26, wherein the at least one electronic componentcomprises at least one semiconductor die including an integratedcircuit, the elongated portion of the at least one fastener beingconfigured to electrically communicate with the integrated circuit ofthe at least one semiconductor die.
 28. The computer system of claim 26,wherein the elongated portion of the at least one fastener comprises atleast one conductive protrusion extending from a lateral surface of theat least one fastener, the at least one conductive protrusion configuredto communicate electrically with at least one of the plurality ofconductive structures disposed on the surface of the at least oneelectronic component.
 29. The computer system of claim 28, wherein theat least one aperture extending through the at least one electroniccomponent extends through one of a conductive terminal on a surface ofthe at least one electronic component and a conductive via extendingthrough the at least one electronic component.
 30. The computer systemof claim 18, wherein at least the elongated portion of the at least onefastener is electrically non-conductive.
 31. The computer system ofclaim 18, wherein the at least one fastener further comprises anintegral end piece integrally formed with the elongated portion, theintegral end piece being disposed at an end of the elongated portion andsized and configured to prevent the integral end piece from passingthrough the at least one aperture extending through the at least oneelectronic component and the at least one aperture extending through theassembly substrate.
 32. The computer system of claim 18, wherein thediscrete end piece has an aperture extending therethrough from a firstend thereof to a second end thereof, the aperture extending through thediscrete end piece being sized and configured to allow the end of theelongated portion to slide at least partially therethrough.
 33. Thecomputer system of claim 18, wherein the elongated portion of the atleast one fastener comprises at least one protrusion on a lateralsurface thereof, and wherein the at least one discrete end piececomprises at least one protrusion on a surface thereof within the atleast one aperture extending therethrough, mechanical interferencebetween the at least one protrusion on the at least one fastener and theat least one protrusion on the discrete end piece at least partiallysecuring the at least one discrete end piece to the end of the elongatedportion.